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|Title:||Manager, Electronics Engineering - PCB's for High Temp Application|
|Job Location:||Tulsa, Oklahoma - United States|
|Salary:||$115,000.00 - $125,000.00 - US Dollars - Yearly|
|Other Compensation:||Eligible for Bonus, 401K, full medical benefits|
|Employer Will Recruit From:||Nationwide|
Global company with engineering and manufacturing operations in Tulsa Oklahoma has an opening for a Manager of their Electronics Engineering department. Previous Manager promoted to VP of Engineering due to a retirement. This position will manage a group of electronics engineers + one mechanical engineer.
CLIENT RECEPTIVE TO SOMEONE READY TO MOVE UP TO A MANAGERIAL ROLE. If candidate has previous team leadership experience, they can be considered for this position.
Manager, Electronics Engineering - downhole tools
Manage a diverse team of up to 5 electronic hardware and firmware professionals to design, develop, and sustain downhole pressure/temperature gauges used on multiple product platforms used within the oil and gas industry.
Use your electronic design hardware and firmware skills to manage and guide engineers in the innovation and design process of new products to meet customers' needs. Understand the spectrum of product lines to direct and manage project schedules to meet deadlines. Develop standards and guidelines to increase efficiency and productivity.
Demonstrate mature judgment to make decisions and recommendations that are conclusive and have a significant impact on company objectives. See priorities and reconcile conflicting directions from competing interests.
Become the product champion in your area of responsibility to interact with Sales, customers and Manufacturing and to understand how the product is used in the field.
Manage a technical team focused on developing products that increase market share and revenue. Set priorities and actively manage the group's program of projects from conception through Production. Decide the type of resources, facilities, tools, and funds are needed to accomplish organizational objectives. Mentor staff to grow in their skill set both technically and professionally.
Other Key Words: FPGA, ASIC, HDL, Firmware, embedded, simulation (BFM), PCB, design, signal integrity, JTAG, VHDL, Verilog C, design for high temperature (up to 250 degC), design for vibration
University - Bachelor's Degree/3-4 Year Degree