Sr Packaging Design Engineer, Electronics - Buffalo, New York United States - 23991

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JOB DESCRIPTION

Job #: 23991
Title: Sr Packaging Design Engineer, Electronics
Job Location: Buffalo, New York - United States
Employment Type:
Salary: contact recruiter for details
Employer Will Recruit From: Nationwide
Relocation Paid?: Yes

WHY IS THIS A GREAT OPPORTUNITY?


Summary

The Sr. Electronics Packaging Engineer to play a critical role in taking our systems to the next level of performance. You will create leading edge packaging solutions for state-of-the-art power, control, and data acquisition systems. Challenges include high power dissipations, high voltages, and extreme thermal and dynamic environments.  Your experience with high power and/or high voltage systems in electronics hardware mechanical design is ideal.

JOB DESCRIPTION

Summary

The Sr. Electronics Packaging Engineer to play a critical role in taking our systems to the next level of performance. You will create leading edge packaging solutions for state-of-the-art power, control, and data acquisition systems. Challenges include high power dissipations, high voltages, and extreme thermal and dynamic environments.  Your experience with high power and/or high voltage systems in electronics hardware mechanical design is ideal.

QUALIFICATIONS

Qualifications include:

  • Master’s Degree in Mechanical, Aeronautical or Electrical Engineering
  • Bachelor's Degree will also be considered with the appropriate experience
  • 5 years of experience with the packaging of electronics systems intended to be used in severe thermal and dynamic environments
  • Knowledgeable of materials and processes relevant to aerospace electronics
  • Familiar with MIL-STD-810 and MIL-STD-1540
  • Experience with solid modeling tools such as Unigraphics NX. 
  • Experience with thermal and structural analysis of aerospace electronics systems is required.
  • Security Clearance a plus, but not required

Education:
University - Bachelor's Degree/3-4 Year Degree